Publications

• Investigation of SiC Power Module Requirements for Smart Grid Applications , IMAPSource Proceedings (2026)
• Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications , IEEE Transactions on Components Packaging and Manufacturing Technology (2025)
• Design, Fabrication, and Operation Challenges of Advanced Power Packaging Technology for EV Power Modules , 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP (2025)
• Innovative Packaging Strategy for MLCCs for High Current AC Applications Aimed at Reducing Parasitic Inductance , 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP (2025)
• Novel Integrated Ferromagnetic-Conductor (IFC) Multilayered Shield Layer for Parasitic Reduction in Power Modules , 2025 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING, IWIPP (2025)
• A 400W, 250kHz (2kW Peak) Integrated GaN Half Bridge Power Module in a Non-Isolated Buck Converter , 2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC (2024)
• FET Junction Temperature Monitoring Using Novel On-Chip Solution , 2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC (2024)
• Investigation of High Current Fine Grain Power Delivery for 3-D Heterogeneous Integration , IEEE Transactions on Components Packaging and Manufacturing Technology (2024)
• Advanced GaN IPM for High-Frequency Converter Applications Enabled with Thin-Substrates , 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (2023)
• Analysis and Characterization of Four-quadrant Switches based Commutation Cell , 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) (2023)